Smart HeatSinks® (SHS) offers innovative and cost effective product design and electronic packaging services for thermal, mechanical, electronic and industrial design disciplines across a wide spectrum of market segments including power electronics, transportation, telecommunications, networking, medical equipment, aerospace, defense, embedded computing and other high performance electronic products. With our over 20 years industrial experiences, clients get their products to market faster, safer, and at a lower cost. Smart HeatSinks® (SHS) also offers thermal analyses and CFD simulation for electronic product cooling to predict the max. junction (Tj-max) of critical electronic components and to reduce the design iterations and tests.
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CFD & Thermal Analysis, RC (Cauer) Network
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We offer the expertise and consultant services in FEA or Cauer Steady or Transient Thermal Analysis and Computational Fluid Dynamics (CFD) simulation for electronic components and systems, which include, but not limited to:
1. IC level - Die and Wire Bonding
2. Printed Circuit Board - Copper Layers, Traces & Vias
3. Open Frame Electronic Products
4. Close Frame/ Enclosure Electronic Products
5. Card Cages / VME Electronic Products
6. Systems level - Racks and Trays
7. Renewable Energy Power and Control Electronics
8. LED Lighting Power and Control Electronics
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Tools: LT Spice, IcePak, FloTHERM, CFDesign
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