Smart HeatSinks® (SHS)
offers
innovative and cost effective product design
and electronic packaging services
for thermal, mechanical, electronic and industrial design disciplines across
a wide spectrum of market segments including power electronics,
transportation,
telecommunications, networking, medical equipment, aerospace, defense,
embedded computing and other high performance electronic products. With our
over 20 years industrial experiences,
clients get their products to market faster, safer, and at a lower cost.
Smart HeatSinks® (SHS)
also
offers thermal
analyses and CFD simulation for electronic product cooling to predict
the max. junction (Tj-max) of critical electronic components and
to reduce the design iterations and tests. |
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CFD & Thermal Analysis, RC
(Cauer) Network |
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We offer the expertise and
consultant services in FEA or
Cauer
Steady or Transient Thermal Analysis and Computational Fluid Dynamics (CFD)
simulation
for electronic components and systems, which include, but not limited to:
1. IC level - Die and Wire Bonding
2. Printed Circuit Board - Copper Layers, Traces & Vias
3. Open Frame Electronic Products
4. Close Frame/ Enclosure Electronic Products
5. Card Cages / VME Electronic Products
6. Systems level - Racks and Trays
7. Renewable Energy Power and Control Electronics
8. LED Lighting Power and Control Electronics |
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Tools: LT Spice,
IcePak, FloTHERM, CFDesign |
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