Smart HeatSinks® offers the patented, high performance, low cost and compact heat sink with matrix clip system (MCS). The heat sink's capacity of holding power devices can be increased transversally & longitudinally. The matrix [i, j] with i spring clips along X axis and j along Y axis makes it very easy for designers to configure electronic packaging. All-in-One solution makes designers be no longer troubled with how to attach devices onto heat sink and how to mount the heat sink assembly onto PCB. This heat sink provides easiest assembly, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling.

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55mm long heat sink, w/two clips for four TO-220 or TO-247 or TO-264 devices. No finish.

55mm long heat sink w/two clips for four TO-220 or TO-247 or TO-264 devices. Black anodized

55mm long heat sink, w/two clips for four TO-220 or TO-247 or TO-264 devices. No finish.

55mm long heat sink w/ two clips for four TO-220 or TO-247 or TO-264 devices. Black anodized